3 Zone Reflow Oven- RF630
The 630 3-Zone Reflow Oven is a compact and efficient reflow soldering system designed for small to medium-scale PCB assembly. Equipped with three temperature-controlled heating zones, it ensures uniform heat distribution and precise soldering for both lead-free and traditional soldering processes. The user-friendly interface, energy-efficient design, and advanced heating technology make it an ideal choice for SMT production lines, prototyping, and low-volume manufacturing.
Product Features
- Three Independent Heating Zones – Ensures precise thermal profiling for various soldering applications.
- Hot Air & Infrared Heating System – Provides even heat distribution for high-quality solder joints.
- Lead-Free Compatible – Designed to meet modern RoHS compliance standards.
- Adjustable Conveyor Speed – Customizable for different PCB sizes and soldering requirements.
- Intelligent Temperature Control – Ensures stable and repeatable results with minimal thermal deviation.
- User-Friendly Touchscreen Interface – Simplifies operation, monitoring, and temperature adjustments.
- Compact & Energy-Efficient Design – Saves space and reduces power consumption while maintaining high efficiency.
Product Applications
- SMT PCB Assembly & Manufacturing.
- Electronics Prototyping & R&D Labs.
- LED Industry.
- Automotive Electronics.
- Medical Device Manufacturing.
- Consumer Electronics & IoT Devices.